STUDY
世平代理之安森美半導體 RSL10 提供業界物聯網、穿戴式、消費等應用最低藍牙功耗
世平集團

專案摘要Executive Summary
無線互聯設備的興起,使得各產業的廠商為在競爭激勵的市場處於優勢地位,必須使他們的無線互聯產品具備低功耗等關鍵特性。而世平代理之安森美半導體 RSL10 ,是利用安森美半導體針對助聽器開發的超低功耗技術,提供行業最低的動態和深度睡眠模式功耗,高度靈活,支持1.1 V至3.3 V的電壓範圍,固件可線上更新,支持2.4 GHz藍牙多協議,先進的封裝技術實現最小的外形,並提供WLCSP、QFN等多種封裝選擇,可設計到專用積體電路(ASIC)中或定制模組中以增強微型化和整合度的優勢。
The rise of wireless internet devices has given manufacturers in various industries a competitive edge in the competitive marketplace and must deliver key features such as low power consumption for their wireless connectivity products. And RSA10, the resolving agent of ON Semiconductor, is an ultra-low power consumption technology developed by ON Semiconductor for hearing aids. It provides the industry's lowest dynamic and deep-sleep mode power consumption, is highly flexible and supports the voltage range of 1.1 V to 3.3 V, Firmware updates online with multi-protocol support for 2.4 GHz Bluetooth, advanced packaging technology for minimal form factor and a wide range of package options including WLCSP, QFN, ASICs or custom modules for enhanced miniature Advantage and integration.

挑戰Challenge
物聯網的迅猛演進促進無線互聯設備的興起,包括移動醫療如助聽器、植體,工業應用如智能樓宇、安全防衛監控,汽車市場如先進駕駛輔助系統(ADAS)、感測器、V2X,無線應用如智慧手機、無線充電、穿戴式電子產品等,都產生巨大的無線互聯需求。廠商要在競爭激勵的市場處於優勢地位,必須使他們的無線互聯產品具備低功耗等關鍵特性。
The rapid evolution of the Internet of Things (IoT) has promoted the rise of wireless Internet devices, including mobile medical devices such as hearing aids, implants, industrial applications such as smart buildings, security and surveillance, automotive markets such as Advanced Driver Assistance Systems (ADAS), Sensors, V2X, Such as smart phones, wireless charging, wearable electronic products, have a huge demand for wireless Internet. Vendors are at a premium in competitively motivated markets and must have key features such as low power consumption for their wireless connectivity products. ​ ​


解決方案Solution
安森美半導體在醫療和無線市場具備多年的經驗和專長,將在超低功耗、微型化封裝等方面的技術和封裝優勢,應用到穿戴式、消費電子及物聯網等市場,推出了藍牙低功耗(BLE)系統單晶片(SoC) RSL10,為無線互聯應用的功耗設立了新的基準。
RSL10具有超低功耗、高度靈活、支持藍牙多協議、超微型等特性;此外,安森美半導體也提供完整的RSL10開發平臺,為加速客戶設計及產品上市進程,安森美半導體提供完整的RSL10開發平臺,包括:
1. 整合開發環境(IDE):包括藍牙協議棧、示例代碼、庫、技術文檔、ARM Cortex-M3處理器開發(GNU toolchain)、採用C語言開發工具包(CDT)的Eclipse等。
2. 開發硬體:包括開發板,並將於2017年第3季度提供USB Dongle。
3. LPDSP32開發工具:根據要求提供支持。
​With years of experience and expertise in the medical and wireless markets, ON Semiconductor has applied the technology and package advantages in ultra-low power and miniaturized packaging to the market for wearable, consumer electronics and IoT markets with low Bluetooth Power Consumption (BLE) The System on Chip (SoC) RSL10 sets a new benchmark for power consumption in wireless Internet applications. RSL10 has ultra-low power consumption, high flexibility, support for Bluetooth multi-protocol, micro-and other features; In addition, ON Semiconductor also provides a complete RSL10 development platform, to accelerate customer design and product launch, ON Semiconductor provides a complete RSL10 development Platform includes:
1. Integrated Development Environment (IDE): Includes Bluetooth protocol stack, sample code, libraries, technical documentation, ARM Cortex-M3 processor development (GNU toolchain), Eclipse using the C language development kit (CDT)
2. Development Hardware: Includes development board and USB Dongle to be available in 3Q 2017.
3. LPDSP32 Development Tools: Support on request.


成效Result
RSL10是高度靈活的、超微型的多協議藍牙5無線認證的系統單晶片(SoC),支持更快的無線連接,為物聯網和互聯的健康與保健等無線互聯應用提供業界最低功耗,最大限度地延長電池使用時間,微型化封裝可實現更小、更輕的設計。安森美半導體還提供完整的RSL10開發平臺,幫助設計人員加快設計進程,在市場競爭中取勝。
The RSL10 is a highly flexible, ultra-miniature multiprotocol Bluetooth 5 wireless-certified system-on-chip (SoC) that supports faster wireless connectivity and offers the industry's lowest power consumption for wireless Internet applications such as IoT and connected health and wellness. Limited battery life, the miniaturized package enables smaller, lighter designs. ON Semiconductor also offers a complete RSL10 development platform to help designers speed up the design process and compete in the market.

資料來源:http://www.wpgholdings.com/wpig/news_detail/zhtw/program/WPI-Wireless78-ON-Semiconductor-RSL10


關於世平興業World Peace Industrial Group
世平集團成立於1980年,為全球第一的半導體零組件通路商大聯大控股旗下成員,代理產品支援多種應用領域的半導體零組,並作為物聯網聚合商,致力於建構ODM、OEM、軟體、雲端、電信及各式運營商、系統整合業者及客戶間的服務平台。世平提供零件推廣、次系統解決方案(Sub-System Solution)及系統整合解決方案(Turnkey Solution),更設立專屬於產品開發測試的實驗室及投資專業的設備儀器,提供客戶完整的技術支持,協助客戶縮短研發週期,快速量產。
World Peace Industrial Group was founded in 1980, being the member of WPG Holdings, the top semiconductor component distributors in the world. WPIG is agent for semiconductor components applied to different fields, and provides sub-system solution and turkey solution. Also as a IoT Aggregator, WPIG dedicated to build ODM, OEM, software, cloud, telecommunication and a variety of operators, system integrators, and the services platform between clients. In addition, WPIG establishes testing labs with professional devices to provide customer full-dimensional technical support.